Original Senju M705-GRN360-K2-V Lead-Free High Temperature Sn96.5Ag3cu0.5 Solder Paste SAC305
Original Senju m705-GRN360-k2-v Lead-Free high Temperature Sn96.5Ag3Cu0.5 Solder Paste
Very stable solder paste viscosity over a longer period
- Lead-free
- Removal of tip oxidation
- No-clean compatible formula
- Minimal residue
- No need to clean
Sepcifications:
Alloy Composition: Sn 96.5: Ag3.0:Cu 0.5
Melting temperature: 217 - 219°C
Powder Size: 25 – 36um
Flux Type: ROL0
SIR (40C 90% RH): Over 1.0 x 1012
Electro-migration Resistance: Over 1.0 x 109 No Migration
Solder paste Viscosity: K1 – 180 ±20 Pa.s; K2 – 200 ±20 Pa.s
Thixotropic Index: 0.6
Flux Content: 11.5%
Hot Slump: 0.4mm
Tackiness: 1.3N
Net Weight: 0.5kg
